Abstract: High-power microwave (HPM) protection for military weaponry demands exceptional sensitivity and reliability. Columnar plasma array (CPA), reflected by adaptable electromagnetic properties ...
To address this challenge, I propose the 5‑Layer Modernization Stack, a practical, implementation‑ready architecture designed specifically for financial institutions adopting generative AI. This ...
Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
AI hardware needs to become more brain-like to meet the growing energy demands of real-world applications, according to researchers. In a study published in Frontiers in Science, scientists from ...
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